ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
Status: WithdrawnPublication date: 2014-08
Edition: 3Number of pages: 16
Technical Committee: ISO/TC 44/SC 12 Soldering materials
- ICS :
- 25.160.50 Brazing and soldering
ISO 9453:2014Stage: 95.99
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