ISO 9453:2006
Soft solder alloys — Chemical compositions and forms
Reference number
ISO 9453:2006
Edition 2
2006-10
Withdrawn
ISO 9453:2006
41923
Withdrawn (Edition 2, 2006)

Abstract

ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:

  • tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
  • tin-antimony;
  • tin-bismuth;
  • tin-copper, with and without silver;
  • tin-indium, with and without silver and bismuth;
  • tin-silver, with and without copper and bismuth;
  • tin-zinc, with and without bismuth.

ISO 9453:2006 also includes an indication of the forms generally available.

General information

  •  : Withdrawn
     : 2006-10
    : Withdrawal of International Standard [95.99]
  •  : 2
     : 10
  • ISO/TC 44/SC 12
    25.160.50 
  • RSS updates

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