ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.
This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
Status: Under development
Edition: 2Number of pages: 19
Technical Committee: ISO/TC 44/SC 12 Soldering materials
- ICS :
- 25.160.50 Brazing and soldering
Buy this standard
|std 1 61|
|std 2 61||Paper|
ISO/DIS 9455-17Stage: 40.60
Got a question?
Check out our FAQs
+41 22 749 08 88
Monday to Friday - 09:00-12:00, 14:00-17:00 (UTC+1)
Keep up to date with ISO
Sign up to our newsletter for the latest news, views and product information.